Method and apparatus for filling a gap

ABSTRACT

According to the invention there is provided a method of filling one or more gaps created during manufacturing of a feature on a substrate by providing a deposition method comprising; introducing a first reactant to the substrate with a first dose, thereby forming no more than about one monolayer by the first reactant; introducing a second reactant to the substrate with a second dose. The first reactant is introduced with a subsaturating first dose reaching only a top area of the surface of the one or more gaps and the second reactant is introduced with a saturating second dose reaching a bottom area of the surface of the one or more gaps. A third reactant may be provided to the substrate in the reaction chamber with a third dose, the third reactant reacting with at least one of the first and second reactant.

FIELD

The present invention generally relates to methods and apparatus for manufacturing electronic devices.

More particularly, the invention relates to a method and apparatus for filling one or more gaps created during manufacturing of a feature on a substrate by providing a deposition method comprising;

introducing a first reactant to the substrate with a first dose, thereby forming no more than about one monolayer by the first reactant; and,

introducing a second reactant to the substrate with a second dose.

BACKGROUND

During manufacturing of an integrated circuit on a substrate gaps e.g. trenches can be created on the substrate. Filling the trenches can take a variety of forms depending upon the specific application.

The basic trench filling process may be subjected to drawbacks, including void formation in the trench during refill. Voids may be formed when the refilling material forms a constriction near the top of the trench before it is completely filled. Such voids may compromise device isolation of the devices on the integrated circuit (IC) as well as the overall structural integrity of the IC. Unfortunately, preventing void formation during trench fill may often place size constraints on the trenches, which may limit device packing density of the device.

If the trenches are filled for device isolation a key parameter in measuring the effectiveness of device isolation may be the field threshold voltage, that is, the voltage necessary to create a parasitic current linking adjacent isolated devices. The field threshold voltage may be influenced by a number of physical and material properties, such as trench width, dielectric constant of the trench filling material, substrate doping, field implant dose and substrate bias.

Void formation may be mitigated by decreasing trench depth and/or tapering trench sidewalls so that the openings may be wider at the top than at the bottom. A trade off in decreasing the trench depth may be reducing the effectiveness of the device isolation, while the larger top openings of trenches with tapering sidewalls may use up additional integrated circuit real estate.

SUMMARY

It is an objective, for example, to provide an improved or at least alternative gap filling method.

Accordingly, there is provided a method of filling one or more gaps created during manufacturing of a feature on a substrate by providing a deposition method comprising;

introducing a first reactant to the substrate with a first dose, thereby forming no more than about one monolayer by the first reactant;

introducing a second reactant to the substrate with a second dose, wherein the first reactant is introduced with a subsaturating first dose thereby reaching only a top area of the surface of the one or more gaps and the second reactant is introduced with a saturating second dose thereby reaching a bottom area of the surface of the one or more gaps; and introducing a third reactant to the substrate with a third dose to react with at least one of the first and second reactant.

By having the subsaturating first dose reaching only a top area of the surface of the one or more gaps with the first reactant, the first reactant will form a monolayer film in the top area of the gap. The latter because there may not be enough first reactant to cover the full gap area or there may not be enough time for the first reactant to reach the bottom. The first reactant in the top area may block further deposition in the top area of the gap for the second reactant. The first and second reactants may not react with each other.

The second reactant may be introduced with a saturating second dose which is blocked in the top area by the first reactant but may be reaching a bottom area of the surface of the one or more gaps. The third reactant may be reacting with at least one of the first and second reactant to fill the gap from the bottom upwards.

According to a further embodiment there is provided a semiconductor processing apparatus to provide an improved or at least alternative gap filling method. The apparatus comprising:

one or more reaction chambers for accommodating a substrate provided with gaps created during manufacturing of a feature on the substrate;

a first source for a first reactant in gas communication via a first valve with one of the reaction chambers;

a second source for a second reactant in gas communication via a second valve with one of the reaction chambers; and

a third source for a third reactant in gas communication via a third valve with one of the reaction chambers; wherein the apparatus comprises a controller operably connected to the first, second and third gas valve and configured and programmed to control:

-   -   introducing with the first valve a subsaturating first dose         reaching only a top area of the surface of the one or more gaps;     -   introducing with the second valve a saturating second dose         reaching a bottom area of the surface of the one or more gaps;         and     -   introducing with the third valve a third reactant to the         substrate in the reaction chamber with a third dose.

For purposes of summarizing the invention and the advantages achieved over the prior art, certain objects and advantages of the invention have been described herein above. Of course, it is to be understood that not necessarily all such objects or advantages may be achieved in accordance with any particular embodiment of the invention.

Thus, for example, those skilled in the art will recognize that the invention may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught or suggested herein without necessarily achieving other objects or advantages as may be taught or suggested herein.

All of these embodiments are intended to be within the scope of the invention herein disclosed. These and other embodiments will become readily apparent to those skilled in the art from the following detailed description of certain embodiments having reference to the attached figures, the invention not being limited to any particular embodiment(s) disclosed.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects, and advantages of the invention disclosed herein are described below with reference to the drawings of certain embodiments, which are intended to illustrate and not to limit the invention.

FIG. 1A is a schematic representation of a PEALD (plasma-enhanced atomic layer deposition) apparatus for filling a gap usable in an embodiment of the present invention.

FIG. 1B illustrates a schematic representation of a precursor supply system using a flow-pass system (FPS) usable in an embodiment of the present invention.

FIG. 2 depicts a flowchart of a method for filling a gap in accordance with a first embodiment.

FIG. 3 depicts a gap being filled in accordance to the first embodiment.

FIG. 4 depicts a gap being filled in accordance to a second embodiment.

FIG. 5 depicts a gap being filled in accordance to a third embodiment.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Although certain embodiments and examples are disclosed below, it will be understood by those in the art that the invention extends beyond the specifically disclosed embodiments and/or uses of the invention and obvious modifications and equivalents thereof. Thus, it is intended that the scope of the invention disclosed should not be limited by the particular disclosed embodiments described below.

FIG. 2 is a flowchart of a method in accordance with at least a first embodiment of the invention in which one or more gaps created during manufacturing of a feature on a substrate may be filled by a deposition method 200. The gaps may be less than 40, 30 or even 20 nm wide. The gaps may be more than 40, 100, 200 or even 400 nm deep.

The method 200 of filling one or more gaps created during manufacturing of a feature on a substrate comprises;

introducing a first reactant in step 201 to the substrate with a first dose, thereby forming no more than about one monolayer by the first reactant;

introducing a second reactant in step 202 to the substrate with a second dose,

wherein the first reactant is introduced in step 201 with a subsaturating (e.g. relatively small and/or short) first dose thereby reaching only a top area of the surface of the one or more gaps and the second reactant is introduced in step 202 with a saturating (e.g. relatively high and/or long) second dose reaching a bottom area of the surface of the one or more gaps; and

introducing a third reactant in step 203 to the substrate with a third dose, the third reactant reacting with at least one of the first and second reactant.

By having a subsaturating first dose for the first reactant in step 201, the first reactant will form a monolayer film in the top of the gap only because there is not enough first reactant to cover the full gap. The first reactant in the top will block further deposition in the top of the gap of the second reactant. The second reactant in step 202 may be introduced with a saturating second dose which may be blocked in the top but may be reaching a bottom area of the surface of the one or more gaps.

A monolayer by the second reactant may be formed in the bottom area if the bottom filling method is an atomic layer deposition (ALD) method. Alternatively, a multilayer of the second reactant may be formed in the bottom area to use as the bottom filling method a chemical vapor deposition (CVD) method.

The third reactant in step 203 may be reacting with at least one of the first and second reactants. The third reactant may react with the second reactant to fill the bottom upwards. It may also react the first reactant away. The third reactant may have a saturating (e.g. relatively high and/or long) dose to reach the bottom of the gap.

Excess reactant and byproduct may be removed after introducing the first, second and/or third reactant to circumvent direct reactions between the reactants causing contamination.

The deposition method 200 may be repeated multiple times to fill the gap as depicted by the loop 204. The reaction may be repeated 1 to 10.000 times, preferably 5 to 2.000 times and most preferably between 10 and 1.000 times via the loop 204.

Alternatively, the deposition method 200 may also be repeated partly, via short cut loop 205, if for example, the top of the gap is still blocked the reactants for reaction in the bottom may still be provided. Also combinations of a complete repeat via loop 204 and a partly repeat via short cut loop 205 may be made. In this way the speed of the gap fill method may be increased.

Example 1

FIG. 3 depicts a gap 206 created during manufacturing of a feature on a substrate being filled according to an embodiment. In a first step 201 there is introduced a first reactant to the substrate with a first dose, thereby forming no more than about one monolayer by the first reactant in the top of the gap 206. The first reactant may be a relatively no growth reactant whereby the first reactant is not reacting with the third reactant. The no growth first reactant may comprise silane such as silanediamine, for example N,N,N′,N′-tetraethyl silanediamine.

In a second step 202 a second reactant is provided to the substrate with a second dose, thereby forming no more than about one monolayer by the second reactant in the bottom of the gap 206.

The first reactant is introduced in step 201 with a subsaturating, relatively small or short, first dose reaching only a top area of the surface of the gap 206 and the second reactant is introduced in step 202 with a saturating, relatively high or long second dose reaching a bottom area of the surface of the gap 206. The second reactant may be a high growth reactant comprising an organometal such as for example an organoaluminum like TMA.

A third reactant may be introduced in step 203 to the substrate with a saturating (e.g. a relatively high or over a relative long time) third dose, the third reactant reacting with the second reactant in the bottom thereby causing growth in the bottom of the gap. The third reactant may comprise water. It is important in this embodiment that the first, second and third reactant are chosen such that the first reactant does not react with the second and third reactant while the second reactant reacts with the third reactant.

The methods may be performed in any suitable ALD apparatus.

Example 2

FIG. 4 depicts a method of filling a gap 206 created during manufacturing of a feature on a substrate according to a second embodiment using a plasma. In a first step 231 there is introduced a first reactant to the substrate with a first dose, thereby forming no more than about one monolayer by the first reactant in the top of the gap 206. The first reactant may be a relatively no growth reactant whereby the first reactant is substantially removed from the surface in reaction with the third reactant.

The first reactant may be an etch sensitive reactant and the third reactant may cause etching of the first reactant so as to remove the first reactant from the surface in the top.

The first reactant may be etch sensitive by comprising an amine group, such as for example a di-isopropyl-amine group.

The first reactant may be etch sensitive by comprising an alkane group, such as for example octane.

Optionally, the first reactant may comprises fluorine and the third reactant may create a plasma which decomposes fluorine from the etch sensitive reactant creating a fluorine plasma etching away the first reactant from the surface in the top. The etch sensitive reactant may comprise trimethoxy (3,3,3-tri-fluoropropyl) silane:

However other fluorine comprising reactants may be useful. The higher the fluorine content the better the etching is.

In a second step 232 a second reactant is provided to the substrate with a second dose. The second reactant may form one monolayer or a multilayer in the bottom of the gap.

The first reactant is introduced in step 231 with a sub saturated first dose reaching only a top area of the surface of the gap and the second reactant is introduced in step 232 with a saturated second dose reaching a bottom area of the surface of the gap but being blocked by the first reactant in the top area of the surface of the gap.

The second reactant may be a high growth reactant. For example comprising an organometal such as for example an organoaluminum like TMA.

The high growth reactant may comprise silane, such as for example a silanediamine such as N,N,N′,N′-tetraethyl silanediamine, such as for example as sold by Air Liquide (Paris, France) under the name ALOHA™ SAM.24. Alternatively Hexakis(ethylamino)disilane i.e. Si2(NHC2H5)6 such as sold by Air Liquide under the name ALOHA™ AHEAD™ or Tris(dimethylamino)silane i.e. C6H19N3Si may be used.

The high growth reactant may comprise an amino silane, such as bis-diethyl-aminosilane.

The high growth reactant may comprise a diiodosilane or a methyl silane, such as a di-vinyl-di-methyl-silane.

A third reactant may be introduced in step 233 to the substrate with a relatively high third dose over a relative long time with a plasma. The third reactant with the plasma may cause removal of the first reactant in the top of the gap directly.

Alternatively, the first reactant may comprise fluorine and the third reactant may create a plasma which removes fluorine from the etch sensitive reactant creating a fluorine plasma etching away the first reactant and possibly any other material from the surface in the top.

The third reactant may also be reacting with the second reactant in the bottom thereby causing growth in the bottom of the gap upwards.

The third reactant may comprise oxygen. The oxygen may be activated by a plasma. The oxygen may be provided in the form of ozone.

The third reactant may comprise nitrogen, hydrogen, hydrazine, and/or ammonia, which may be activated by a plasma.

The deposition method may be repeated in step 234 creating an increasing thicker SIO layer in the bottom of the gap.

It is proposed to improve gap fill and seam in the gap by filling the gap bottom upwards. Inhibiting chemisorption in the opening of the gap with the first reactant before CVD and ALD deposition may effect that. The film is subsequently deposited bottom up. The method may achieve seam and void free filled gaps.

The following three comparative experiments (Comp seq) have been compared with three experiment (Ex seq.) according to embodiments of the invention in three different sequences at a pressure of 400 Pa, a carrier flow of 2 slm and a dilute flow of 1 slm.

Results

Temp RF Reactant 3 Ex Reactant 1 Reactant 2 (° C.) (W) (slm) Com seq 1 — Bis-Diethyl-Aminosilane 300 100 O2 (0.1) Com seq 2 — Bis-Diethyl-Aminosilane 400 200 NH3 (2) Com seq 3 — Di-Vinyl-Di-Methyl-Silane 300 100 O2 (0.1) Ex seq. 1 Di-Isopropyl-Amine Bis-Diethyl-Aminosilane 300 100 O2 (0.1) Ex seq. 2 Octane Bis-Diethyl-Aminosilane 400 200 NH3 (2) Ex seq. 3 Di-Isopropyl-Amine Di-Vinyl-Di-Methyl-Silane 300 100 O2 (0.1)

Results

GPC 100:1 DHF Side Coverage Ex (nm/cycle) RI WER(nm/min) @AR4(%) Filling Method Com seq 1 0.1 1.47 3.8 99 Conformal Shape Com seq 2 0.05 1.88 1.2 95 Conformal Shape Com seq 3 0.03 1.71 0.1 90 Conformal Shape Ex. Seq. 1 0.0008 1.46 2.9 Top side: <5 Bottom Up Middle side: 10 Shape Bottom side: 90 Ex. Seq. 2 0.0009 1.96 0.8 Top side: <5 Bottom Up Middle side: 8 Shape Bottom side: 80 Ex. Seq. 3 0.0007 1.78 0.1 Top side: <5 Bottom Up Middle side: <5 Shape Bottom side: 95 Seq. 1 ALD standard

Inhibitor Si Parameter Feed Purge RF Purge Feed Purge RF Purge First X reactant 1 Second X reactant 2 Third X X X X reactant 3 Carrier X X X X X X X X Dilution X X X X X X X X RF X X

Seq. 2 ALD

Inhibitor Si Parameter Feed Purge Feed Purge RF Purge First reactant X Second reactant X Third reactant X X X X Carrier X X X X X X Dilution X X X X X X RF X

Seq. 3 CVD Standard

Inhibitor Parameter Feed Purge Start-Depo Stabilize RF Purge First reactant X Second reactant X X X Third reactant X X X Carrier X X X X Dilution X X X X X X RF X

In the CVD sequence the second and third reactants are provided simultaneously providing high growth. It is shown that the examples according to the embodiments (Ex seq) give a higher deposition in the bottom of the gap than in the top improving the gap fill properties.

The methods according to the invention may, for example, be performed with a semiconductor processing apparatus comprising:

one or more reaction chambers for accommodating a substrate provided with gaps created during manufacturing of a feature on the substrate;

a first source for a first reactant in gas communication via a first valve with one of the reaction chambers;

a second source for a second reactant in gas communication via a second valve with one of the reaction chambers; and

-   -   a third source for a third reactant in gas communication via a         third valve with one of the reaction chambers; wherein the         apparatus comprises a controller operably connected to the         first, second and third gas valve and configured and programmed         to control:

introducing with the first valve a subsaturating first dose reaching only a top area of the surface of the one or more gaps;

introducing with the second valve a saturating second dose reaching a bottom area of the surface of the one or more gaps; and

introducing with the third valve a third reactant to the substrate with a third dose.

Optionally, the apparatus may be provided with a heater to activate the reactions by elevating the temperature of one or more of the substrate, the first, second and third reactants. Exemplary single wafer reactors, designed specifically to perform ALD processes, are commercially available from ASM International NV (Almere, The Netherlands) under the tradenames Pulsar®, Emerald®, Dragon® and Eagle®. Exemplary batch ALD reactors, designed specifically to perform ALD processes, are commercially also available from and ASM International N.V under the tradenames A400™ and A412™.

Optionally, the apparatus may be provided with a radiofrequency source operably connected with the controller constructed and arranged to produce a plasma of the first, second or third reactant. The plasma enhanced atomic layer deposition PEALD may be performed in an Eagle® XP8 PEALD reactor available from ASM International N.V. of Almere, the Netherlands which apparatus comprises a plasma source to activate one or more of the reactants.

The process cycle with a plasma may be performed using an apparatus illustrated in FIG. 1A, for example. FIG. 1A is a schematic view of a PEALD apparatus, desirably in conjunction with controls programmed to conduct the sequences escribed herein, usable in some embodiments of the present invention. In this figure, by providing a pair of electrically conductive flat-plate electrodes 4, 2 in parallel and facing each other in the interior 11 (reaction zone) of a reaction chamber 3, applying HRF power (13.56 MHz or 27 MHz) 20 to one side, and electrically grounding the other side 12, a plasma is excited between the electrodes.

A temperature regulator is provided in a lower stage 2 (the lower electrode), and a temperature of a substrate 1 placed thereon is kept constant at a given temperature. The upper electrode 4 serves as a shower plate as well, and reactant gas (and noble gas) and precursor gas are introduced into the reaction chamber 3 through a gas line 21 and a gas line 22, respectively, and through the shower plate 4.

Additionally, in the reaction chamber 3, a circular duct 13 with an exhaust line 7 is provided, through which gas in the interior 11 of the reaction chamber 3 is exhausted. Additionally, a transfer chamber 5 disposed below the reaction chamber 3 is provided with a seal gas line 24 to introduce seal gas into the interior 11 of the reaction chamber 3 via the interior 16 (transfer zone) of the transfer chamber 5 wherein a separation plate 14 for separating the reaction zone and the transfer zone is provided (a gate valve through which a wafer is transferred into or from the transfer chamber 5 is omitted from this figure). The transfer chamber is also provided with an exhaust line 6. In some embodiments, the deposition of multi-element film and surface treatment are performed in the same reaction space, so that all the steps can continuously be conducted without exposing the substrate to air or other oxygen-containing atmosphere. In some embodiments, a remote plasma unit can be used for exciting a gas.

In some embodiments, in the apparatus depicted in FIG. 1A, the system of switching flow of an inactive gas and flow of a precursor gas illustrated in FIG. 1B (described earlier) can be used to introduce the precursor gas in pulses without substantially fluctuating pressure of the reaction chamber.

In some embodiments, a dual chamber reactor (two sections or compartments for processing wafers disposed closely to each other) can be used, wherein a reactant gas and a noble gas can be supplied through a shared line whereas a precursor gas is supplied through unshared lines.

A skilled artisan will appreciate that the apparatus includes one or more controller(s) (not shown) programmed or otherwise configured to cause the deposition and reactor cleaning processes described elsewhere herein to be conducted. The controller(s) are communicated with the various power sources, heating systems, pumps, robotics, and gas flow controllers or valves of the reactor, as will be appreciated by the skilled artisan.

Example 3

FIG. 5 depicts a method of filling gaps 206 created during manufacturing of a feature on a substrate according to a third embodiment also using a plasma. In this embodiment the second reactant may be a relatively high growth rate reactant in reaction with the third reactant whereas the first reactant may be a low growth rate reactant in reaction with the third reactant. In this way the layer in the bottom of the gap is growing faster than in the top of the gap so that the growth in the top will not block the growth in the bottom.

The first reactant being the low growth rate reactant may be provided in step 241 and may comprise silane. The low growth rate reactant may comprise diiodomethylsilane, alkylchlorosilanes, alkylalkoxysilanes, alkylaminosilanes, or methoxy(dimethyl)octylsilane:

This silanes may have long alkyl groups blocking further reaction in the top.

The second reactant may be provided in step 242 and may be a high growth reactant comprising silane such as silanediamine or aminosilane. The silanediamine may be N,N,N′,N′-tetraethyl silanediamine such as for example as sold by Air Liquide (Paris, France) under the name ALOHA™ SAM.24.

The first reactant may inhibit the adsorption of the second reactant in the top area of the one or more gaps.

The third reactant provided in step 243 may comprise oxygen. The oxygen may be activated by a plasma. The oxygen may be provided with ozone.

The third reactant provided may comprise nitrogen, hydrogen, hydrazine, and/or ammonia, which may be activated by a plasma.

The deposition process with steps 241, 242 and 243 may be repeated in step 244 to fill the gap bottom up.

The first reactant may be SiCl₄, the second reactant TMA (trimethylaluminium) and the third reactant may be ozone or ammonia.

Alternatively, the first reactant may be silanediamine, the second reactant hexakis ethylamino disilane and the third reactant may be ozone or peroxide. The first reactant may be SiCl₄, the second reactant silanediamine and the third reactant may be ozone or hydrogen peroxide.

The subsaturating first dose may be provided with a pulse having a duration of between 0.1 to 3 seconds, preferably 0.3 to 1 second and most preferably less than 0.5 seconds in a single wafer reaction chamber but may be longer in a batch wafer system.

The methods of the third embodiment may be performed in any one of the apparatus mentioned in the first example and FIGS. 1A and 1B.

It is to be understood that the configurations and/or approaches described herein are exemplary in nature, and that these specific embodiments or examples are not to be considered in a limiting sense, because numerous variations are possible. The specific routines or methods described herein may represent one or more of any number of processing strategies. Thus, the various acts illustrated may be performed in the sequence illustrated, in other sequences, or omitted in some cases.

The subject matter of the present disclosure includes all novel and nonobvious combinations and sub-combinations of the various processes, systems, and configurations, and other features, functions, acts, and/or properties disclosed herein, as well as any and all equivalents thereof. 

1. A method of filling one or more gaps created during manufacturing of a feature on a substrate by providing a deposition method comprising: introducing a first reactant to the substrate with a first dose; introducing a second reactant to the substrate with a second dose, wherein the second reactant is substantially blocked by the first reactant, and wherein the first reactant is introduced with a sub saturating first dose reaching a top area of the surface of the one or more gaps and the second reactant is introduced with a saturating second dose reaching a bottom area of the surface of the one or more gaps; and introducing a third reactant to the substrate with a third dose, the third reactant reacting with at least one of the first and second reactant.
 2. The method according to claim 1, wherein the method comprises removing excess reactant and byproduct from the reaction chamber after each step of introducing a first, second and/or third reactant.
 3. The method according to claim 1, wherein the deposition method is repeated multiple times to fill the gap.
 4. The method according to claim 1, wherein the second reactant is a relatively high growth rate reactant in reaction with the third reactant.
 5. The method according to claim 1, wherein the first reactant is a low growth rate reactant in reaction with the third reactant.
 6. The method according to claim 5, wherein the low growth rate reactant comprises silane.
 7. The method according to claim 6, wherein the low growth rate reactant comprises one or more reactants of a group of reactants comprising diiodomethylsilane, methoxy(dimethyl)octylsilane, alkylchlorosilanes, alkylalkoxysilanes, and alkylaminosilanes.
 8. The method according to claim 1, wherein the first reactant is a relatively no growth reactant whereby the first reactant is substantially removed from the surface in reaction with the third reactant.
 9. The method according to claim 8, wherein the no growth reactant is an etch sensitive reactant and the third reactant causes etching of the first reactant so as to remove the first reactant from the surface.
 10. The method according to claim 9, wherein the first reactant comprises fluorine and the third reactant creates a plasma which removes fluorine from the etch sensitive reactant creating a fluorine plasma etching away the first reactant.
 11. The method according to claim 10, wherein the etch sensitive reactant comprises trimethoxy (3,3,3-tri-fluoropropyl) silane.
 12. The method according to claim 9, wherein the etch sensitive reactant comprises an amine group.
 13. The method according to claim 12, wherein the etch sensitive reactant comprises a di-isopropyl-amine group.
 14. The method according to claim 9, wherein the etch sensitive reactant comprises an alkane group.
 15. The method according to claim 14, wherein the etch sensitive reactant comprises octane.
 16. The method according to claim 4, wherein the relatively high growth reactant comprises silane.
 17. The method according to claim 16, wherein the silane comprises silanediamine.
 18. The method according to claim 17, wherein the silanediamine comprises N,N,N′,N′-tetraethyl silanediamine.
 19. The method according to claim 17, wherein the silanediamine comprises amino silane.
 20. The method according to claim 16, wherein the silane comprises methyl silane or diiodosilane.
 21. The method according to claim 1, wherein the third reactant comprises oxygen.
 22. The method according to claim 21, wherein the oxygen is activated by a plasma.
 23. The method according to claim 21, wherein the oxygen is provided by ozone.
 24. The method according to claim 1, wherein the third reactant comprises nitrogen, hydrogen, hydrazine, and/or ammonia.
 25. The method according to claim 1, wherein the third reactant is activated by a plasma.
 26. The method according to claim 4, wherein the relatively high growth reactant comprises an organometal.
 27. The method according to claim 26, wherein the organometal comprises an organoaluminum.
 28. The method according to claim 27, wherein the organoaluminum comprises a trimethylaluminium.
 29. The method according to claim 26, wherein the organometal comprises tantalum.
 30. The method according to claim 29, wherein the organometal comprises tertiarybutylimido, tris(diethylamino)tantalum.
 31. The method according to claim 26, wherein the first reactant is a relatively no growth reactant.
 32. The method according to claim 31, wherein the relatively no growth reactant comprises silane.
 33. The method according to claim 32, wherein the silane comprises silanediamine.
 34. The method according to claim 33, wherein the silanediamine comprises N,N,N′,N′-tetraethyl silanediamine.
 35. The method according to claim 31, wherein the third reactant comprises water.
 36. The method according to claim 26, wherein the first reactant is SiCl₄ and the third reactant is ozone.
 37. The method according to claim 1, wherein the first reactant inhibits the adsorption of the second reactant in the top area of the one or more gaps.
 38. The method according to claim 1, wherein the method comprises introducing the second and third reactant simultaneously.
 39. The method according to claim 1, wherein introducing a second reactant to the substrate with the saturating second dose reaching a bottom area of the surface of the one or more gaps and introducing a third reactant to the substrate with a third dose, the third reactant reacting with the second reactant is repeated multiple times to fill the gap while the first reactant is inhibiting deposition in the top area of the gap.
 40. (canceled) 